HELiOS 2019 Service Pack 2 comes with a multitude of user-oriented new and enhanced features for an easy and efficient product data management. The developmental focus was on our multi-CAD interfaces that will certainly impress you with their numerous functional enhancements. This includes, for instance, the fundamentally redesigned and optimized HELiOS Workspace. Further highlights are the adjustment of the HELiOS function for AutoCAD to match the standards of the other CAD interfaces, the further improved attribute mapping, or the enhanced batch import in HELiOS for Autodesk Inventor. What’s also new in all CAD interfaces and the Office interface is that the document structure is shown on the Model structure Ribbon of the document master data if no model structure exists for a document.
And in addition to the HELiOS integration in EPLAN, a comparable integration is now also available for the electro-technical system E3 of the company Zuken. Furthermore a new standard ERP interface between HELiOS and the ERP System Taxmetall is available, thus adding a new member, the company Vectotax, to the partner portfolio of the ISD. 

Please note:
The HELiOS-SOLIDWORKS interface now features the new HELiOS masks and the new Workspace. As part of this change, the interface now also offers some new functions, which are already known to the user from the HELiOS-Inventor interface. The new interface will be released for the first time with Version 2020. 

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